NXP Semiconductors
is ending the internal PCM1.x manufacturing of 8‑pin contact modules.
Discontinuation Information NXP
202306046DN: NXP MIFARE SAM 8‑pin contact chip modules
This affects all sales items delivered in PCM 8 Contact (SOT658) delivery type of MIFARE SAM AV2 and
MIFARE SAM AV3. The machines and materials used for the assembly of these module
types will be dismounted at NXP Semiconductors manufacturing site by end of the 2023.
After discontinuation, NXP Semiconductors will supply sawn silicon wafer materials to
customers. NXP Semiconductors partner for the packaged 8 Contact Module is AdvanIDe.
AdvanIDe releases a new Module Packaging Service for NXP MIFARE SAM AV2 and MIFARE SAM AV3 IC from NXP.
AdvanIDe has qualified a new 8 Contact Module (AC8G2) for the NXP MIFARE SAM.

The reel size is around 8 K pcs. Smaller requests could be handled with the well known AdvanIDe cut service for smaller reel QTYs.
MIFARE SAM AV3
MO NXP MF4SAM3U15/9BA6AU AC8G2
MIFARE SAM AV2
MO NXP P5DF081UA/T1AD2060 AC8G2

