Mr. Holger Roessner is the CEO of AdvanIDe Holdings Pte Ltd – Advanced ID Electronics and Managing Partner of IDentivest Partners Pte Ltd. He is an experienced entrepreneur in the field of secure identity, electronic governance, smart cities, transport and ticketing, IoT with a proven track record of more than 25 years in senior management positions in the smart card and secure ID industry. He is holding multiple related investments in Europe and Asia and participated in various IPOs and M&A transactions. Having started his career as Management/Sales Trainee at Siemens Semiconductor (today Infineon Technologies), Holger moved from Europe to Asia in 1996, where he was the Business Manager Asia Pacific for Siemens Automation overlooking the sales and business development activities of the Siemens Identsystem division (MOBY ID, CardOS).
In 1998, Holger joined ACG AG as Managing Partner and set-up the Asia Pacific operation of ACG, which grew to become the leading provider for ID and chip card semiconductors in Asia. In 2001 Holger led a pre-IPO investment in ITE Holdings Ltd. (HK) as part of the ACG partner investment fund, which he exited in 2016 when he also ceased to be an independent advisor.
ACG was acquired by Swedish access solution provider ASSA ABLOY in 2003 and subsequently, in 2007, he was appointed the Global Managing Director for a newly created entity called AdvanIDe – Advanced ID Electronics. Within ASSA ABLOY, Holger served as a member of the Executive Committee at HID Global from 2012 to 2017. HID is a global leader for secure identity solutions, headquartered in Austin, Texas.
In 2017, Holger executed a management-buy-out of AdvanIDe, which led to the investment in the company by the Japan South-East Asia Growth Fund L.P.
In 2022, Holger founded IDentivest Holdings Ltd, that acquired all shares of AdvanIDe from RISA and henceforth AdvanIDe has been fully employee and management owned.
During his studies, Holger received scholarships from the HANNS-SEIDEL Foundation as well as Siemens AG. He graduated from the University of Applied Sciences in Schweinfurt, Germany, with degrees in Electrical Engineering/Information Technology and Business Administration & Engineering with numerous awards. He holds multiple patents with more pending.